The Chinese semiconductor industry has reached a significant milestone with the official release and implementation of the country's first-ever group standard for semiconductor-grade ozone generators. Issued on December 9, 2025, the "Technical Requirements for Semiconductor-Grade Ozone Generators" (T/CIET 1946-2025) was led by Qingdao Guolin Semiconductor Technology Co., Ltd. in collaboration with 17 leading enterprises across the semiconductor supply chain .
This landmark standard fills a critical gap in domestic technical specifications for ozone equipment used in semiconductor and panel display manufacturing. Ozone generators play an indispensable role in key semiconductor processes including thin-film deposition, wafer cleaning, and photoresist removal, where their technical performance and reliability directly impact chip fabrication yields .
Ozone Machine technology has become essential in modern semiconductor fabs, where surface cleanliness requirements have reached atomic-level precision. Recent laboratory testing demonstrates that advanced UV ozone cleaning systems can reduce organic contaminants on silicon wafers from 50nm to just 0.5nm, achieving a 100-fold improvement in cleaning efficiency compared to traditional methods . This level of precision is critical as the industry advances toward 5nm and 3nm process nodes.
Industrial Ozone Generators designed for semiconductor applications utilize corona discharge or ultraviolet methods to generate precise ozone concentrations tailored to specific manufacturing requirements . Unlike conventional wet cleaning processes that rely on sulfuric acid and hydrogen peroxide—which can leave chemical residues and generate significant wastewater—ozone-based cleaning offers a dry, residue-free alternative that decomposes naturally into oxygen after use .
The newly established standard was developed through extensive collaboration involving key industry players including Beijing North Huachuang Microelectronics Equipment Co., HuaHai Qingke Co., Tuojing Semiconductor Equipment, and Shengmei Semiconductor Equipment, among others . This broad industry participation ensures the standard's scientific rigor, applicability, and representativeness across the semiconductor ecosystem.
Ozone Disinfection Machine applications extend beyond wafer cleaning to include advanced oxidation processes for removing organic contaminants from semiconductor manufacturing equipment and facilities. The technology effectively eliminates photoresist residues, organic solvent traces, and airborne molecular contaminants that can compromise chip yields .
The standardization effort, which began with project approval in March 2025 and concluded with final release in December 2025, establishes comprehensive technical specifications and reliability benchmarks for ozone generation equipment . This provides semiconductor manufacturers with clear, quantifiable criteria for equipment selection and process validation.
Industry analysts project that the global ozone generator market will reach $2.36 billion by 2030, growing at a CAGR of 8.0%, driven partly by increasing investments in semiconductor manufacturing infrastructure and the need for advanced cleaning solutions . The new Chinese standard positions domestic manufacturers to compete more effectively in this expanding market while supporting the broader national initiative to strengthen domestic semiconductor equipment capabilities.
Looking ahead, the implementation of this standard is expected to accelerate the adoption of domestically produced ozone generators in Chinese semiconductor fabs, reducing reliance on imported equipment while ensuring consistent quality and performance. As the semiconductor industry continues its rapid expansion, standardized ozone technology will play an increasingly vital role in enabling the precise, contamination-free manufacturing environments required for next-generation chip production.
